Component · Packaging & Assembly
Solder ball
The spherical solder interconnect attached to the underside of a BGA or CSP that forms the second level joint to the printed circuit board. Ball diameter, pitch and alloy set the standoff, reliability and reflow profile.
- Also known as
- BGA ball, Solder sphere
- Type
- Component
- Domain
- Packaging & Assembly, Die attach and interconnect
Notes
Almost all volume production uses lead-free SAC alloys since RoHS, which raised reflow peak temperatures by roughly 30 degrees Celsius.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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