Acronym · Packaging & Assembly
MUF (Molded Underfill)
A process in which the same epoxy moulding compound that forms the package body is forced under the flip chip die in one transfer moulding step, replacing a separate capillary underfill dispense and cure.
- Also known as
- Moulded underfill
- Type
- Acronym
- Domain
- Packaging & Assembly, Die attach and interconnect
Notes
Saves a process step and improves warpage control, but demands tight filler size control so the compound can flow through the bump field.
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