Acronym · Packaging & Assembly
mSAP (modified Semi-Additive Process)
A substrate and printed circuit board patterning method that starts from a very thin seed copper layer and plates conductors up inside a resist mould, giving straighter sidewalls and finer line and space than subtractive etching.
- Also known as
- Modified semi-additive process, SAP (related)
- Type
- Acronym
- Domain
- Packaging & Assembly, Substrates
Notes
Moved from IC substrates into smartphone motherboards from around 2017, enabling roughly 30 micrometre line and space.
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