Process · Photonics, MEMS & Sensors
Fusion bonding
Direct wafer bonding where two clean, flat, activated surfaces join by van der Waals forces and are then annealed into covalent bonds, without any intermediate adhesive layer.
- Also known as
- Direct bonding, Silicon direct bonding
- Type
- Process
- Domain
- Photonics, MEMS & Sensors, MEMS
Notes
Demands sub-nanometre surface roughness and near-perfect cleanliness, so it is the least forgiving of the bonding options.
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