Process · Photonics, MEMS & Sensors
Eutectic bonding
Wafer bonding using a metal pair such as aluminium and germanium or gold and silicon that melts at a low eutectic temperature, forming a hermetic, electrically conductive seal ring.
- Also known as
- AlGe bonding, AuSi bonding
- Type
- Process
- Domain
- Photonics, MEMS & Sensors, MEMS
Notes
Tolerant of surface topography and particles, and the conductive seal can double as an electrical interconnect.
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