Acronym · Packaging & Assembly
CSP (Chip Scale Package)
Any package whose body area is no more than about 1.2 times the die area, so the finished part is effectively the size of the silicon. The category covers wafer level, fan-in and very small laminate constructions.
- Also known as
- Chip-scale package
- Type
- Acronym
- Domain
- Packaging & Assembly, Package families
Notes
Defined by a size ratio rather than a construction, so two CSPs from different suppliers can be built in completely different ways.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
Where it appears on the Hub
Used on 3 pages of the Hub. In each group, the pages that mention it most come first.
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