Acronym · Packaging & Assembly
BoW (Bunch of Wires)
An Open Compute Project die-to-die physical interface specification aimed at organic substrate packages, using simple parallel single-ended signalling to keep the PHY area and power low.
It targets standard packaging rather than silicon interposers.
- Also known as
- OCP BoW, Open HBI (related), OpenHBI-adjacent
- Type
- Acronym
- Domain
- Packaging & Assembly, Chiplets
- Also relevant to
- Design & Architecture, Interfaces & SerDes
Notes
Developed within the OCP Open Domain-Specific Architecture project as a royalty-free alternative to proprietary die-to-die links.
Related terms
Part of the Packaging & Assembly glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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Standards
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