Using IR thermal imaging on powered die, packages and boards to locate hot spots, shorts and leakage paths — including emissivity correction, lock-in thermography for weak signals, and correlating thermal maps to circuit blocks.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: FA or reliability lab work on an IR/lock-in thermography station; vendor training plus mentored casework.
Register version 1.