Package Thermal Engineer

Project

Work done for a product or program.

• Build detailed and compact thermal models of the package, including die stack, TIM layers, lid, substrate and board, correlated to measurement.
• Run power-map-driven transient and steady-state simulations to locate hot spots and quantify die-to-die thermal coupling in stacked assemblies.
• Specify thermal interface materials, bond line thickness and lid attach processes together with materials and assembly engineers.
• Define cooling requirements — heatsink, cold plate, flow rate, inlet temperature, socket load — and negotiate them with system and platform teams.
• Perform electrothermal co-simulation coupling leakage, voltage droop and temperature to capture thermal runaway margin.
• Validate thermal models against instrumented test vehicles using thermal test dies, thermocouples and infrared thermography.
• Support dynamic thermal management strategy with firmware and architecture teams, including sensor placement and throttling thresholds.
• Analyse thermal impact of packaging choices such as underfill removal in hybrid bonding, molded versus lidded construction and backside power delivery.
• Drive advanced cooling exploration including direct liquid cooling, vapour chambers, diamond heat spreaders and microfluidic channels.

Function

Work that keeps the discipline running: methods, tools, suppliers and people.

• Derive junction-to-case, junction-to-board and junction-to-ambient thermal resistance per JEDEC JESD51 and publish them for system designers.

Project

1. Produce and hand over the role's key deliverables
   • Detailed and compact thermal model set (CTM / DELPHI)
   • Thermal resistance datasheet parameters per JESD51
   • Power map based hot-spot analysis report
   • TIM and lid attach specification
   • Thermal design guide and cooling requirement document
   • Model-to-measurement correlation report
2. Design the blockGeneral
   • Write or capture the design to the specification
   • Run lint, simulation or circuit checks
   • Close design reviews and their actions
3. Support integration and sign-offGeneral
   • Fix bugs found by verification
   • Support timing and physical closure
   • Deliver handoff files and documentation

Function

1. Keep design methods currentGeneral
   • Maintain coding and design standards
   • Build and maintain reusable blocks
2. Develop peopleGeneral
   • Mentor newer engineers
   • Run design reviews and knowledge sharing sessions