Combined power-integrity signoff on die: static and dynamic IR/IV drop against the voltage budget alongside EM current-density checks, run in RedHawk-SC or Voltus with realistic switching activity and package/board models.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: Physical design or signoff role at an advanced node, learned against the foundry's reliability rule deck and internal signoff criteria.
Register version 1.