Thermal simulation of packages, boards and enclosures in Ansys Icepak: building the geometry and material stack, setting boundary conditions and airflow, meshing, and extracting junction temperatures, theta-JA/JB and hotspot maps.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: Thermal or package engineering role, from Ansys training plus heat-transfer fundamentals and lab correlation.
Register version 1.