Also known as: Die Bond Process Engineer; Pick-and-Place Process Engineer; Assembly Process Integration Engineer
See this role on the Chiplet lifecycle or on the Power and compound lifecycle or on the MEMS and sensors lifecycle or on the Package technology lifecycle or on the SoC lifecycle
Owns the die attach and die placement steps of the assembly line — epoxy or film adhesion, bond line thickness, placement accuracy and tilt — and keeps them in statistical control at production volume. Is the process owner where silicon first meets the package.
Work in progressNo day-in-the-life description has been written for this role yet. If you do this work, we would welcome yours. Suggest a source or a correction
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