The AI Packaging Bottleneck Is a Materials Opportunity

By Julia Woertink, VP of R&D of Semiconductor Technologies at Qnity Electronics For decades, semiconductor progress followed a simple formula: shrink the transistor, fit more on a chip, and deliver more performance at lower cost. That formula still works, but it no longer works alone. Each new node in both logic and memory is harder […] The post The AI Packaging Bottleneck Is a Materials Opportunity appeared first on IMAPS 3D InCites Content Platform.

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