Sikama Develops Next-Generation Reflow Platform for Advanced Panel-Level Packaging

New platform builds on Sikama’s proven UP1200 technology with support for 310 × 310 mm panels, <10 ppm O₂, ultra-low vibration and ±2°C temperature uniformity, with larger panel formats in development Sikama International, Inc., a leading provider of advanced thermal processing equipment for semiconductor and microelectronics manufacturing, today announced the development of a next-generation reflow […] The post Sikama Develops Next-Generation Reflow Platform for Advanced Panel-Level Packaging …

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