News / Packaging & Test / Mixx Technologies Backs Open Standards for Near-Package Optical Connectivity
Mixx Technologies Backs Open Standards for Near-Package Optical Connectivity
By The Semiconductor Hub news desk ·
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Mixx Technologies, Inc. today set out its view of high-density optical scale-up as a member of the Expanded Beam Optics Multi-Source Agreement (EBO MSA) and a contributing member of the Open CPX MSA. The post Mixx Technologies Backs Open Standards for Near-Package Optical Connectivity appeared first on Semiconductor Digest.
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