Chip lifecycle / RF lifecycle / Module & Antenna-in-Package Integration

Module & Antenna-in-Package Integration

Integrating the die with filters, switches, matching networks, passives and antennas in a module or an antenna-in-package, designing the substrate and the transitions between die, package and board, and measuring the assembled module, including antenna patterns and beam steering for phased arrays, so the product is proven as the customer will use it.

Where this stage sits

This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.

Stage

^D07 RF Characterisation & S-parameter Measurement

^A08 Module & Antenna-in-Package IntegrationYou are here

^A09 Regulatory & Conformance Testing

Product milestones

ESEngineering samples MSModule samples CGConformance and certification passed

RF engineering milestones

TOTape-out FSFirst silicon SCMeasurement and model correlation MDFModule and antenna design freeze PCPre-compliance passed QLQualification start

Product, standards and market^AO

0.8

RF system architecture and link budget^A

Freeze^A

Technology, devices and models^A

1.0^A

RF and mmWave circuit design^D

Freeze

Electromagnetic modelling and extraction^A

1.0

Calibration, control and firmware^A

0.8

1.0

Freeze

Module, package and antenna-in-package^A

1.0

Freeze^A

RF characterisation and measurement^D

1.0^DA

Regulatory and conformance testing^A

1.0^DA

Quality and reliability^A

0.5

0.8

Operations, supply and end of life^AA

Key0.0Specified0.3Sketched0.5Simulated0.8Feature complete1.0CompleteFreezeFrozenFaded block: still at the step shown before it, Held below Complete or Maintained under change control once complete or frozenFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateYou are here: Module & Antenna-in-Package IntegrationAI impactDisruption (red)Augmentation (blue)Opportunity (green)How AI is changing the workWhat the steps mean What the codes mean

Show this chart as a list

Stages

RF Characterisation & S-parameter Measurement^D
Module & Antenna-in-Package Integration (this stage)^A
Regulatory & Conformance Testing^A

Product milestones

RF engineering milestones

Disciplines

Product, standards and market^AO
- RF Characterisation & S-parameter Measurement: maturity 0.8, Feature complete. Samples with lead customers, first as parts and then as modules, while certification and qualification run.
- Module & Antenna-in-Package Integration: maturity 0.8, Feature complete. Samples with lead customers, first as parts and then as modules, while certification and qualification run.
- Regulatory & Conformance Testing: maturity 0.8, Feature complete. Samples with lead customers, first as parts and then as modules, while certification and qualification run.
RF system architecture and link budget^A
- RF Characterisation & S-parameter Measurement: maturity Freeze, Frozen. Architecture and budget fixed in the taped-out design; measured results update the budget under change control.^A
- Module & Antenna-in-Package Integration: maturity Freeze, Frozen. Architecture and budget fixed in the taped-out design; measured results update the budget under change control.
- Regulatory & Conformance Testing: maturity Freeze, Frozen. Architecture and budget fixed in the taped-out design; measured results update the budget under change control.
Technology, devices and models^A
- RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Models correlated with de-embedded silicon measurements, with differences explained and fed back to the foundry.^A
RF and mmWave circuit design^D
- RF Characterisation & S-parameter Measurement: maturity Freeze, Frozen. Design fixed in the tape-out database; silicon debug feeds the issue log and the next revision.
Electromagnetic modelling and extraction^A
- RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Full electromagnetic extraction of the layout complete, with coupling and isolation within budget; package models and silicon correlation build on it.
- Module & Antenna-in-Package Integration: maturity 1.0, Complete. Full electromagnetic extraction of the layout complete, with coupling and isolation within budget; package models and silicon correlation build on it.^A
Calibration, control and firmware^A
- RF Characterisation & S-parameter Measurement: maturity 0.8, Feature complete. Control interface map and calibration specification final with the schematics; the algorithms wait for silicon.
- Module & Antenna-in-Package Integration: maturity 1.0, Complete. Calibration algorithms, tables and module control software released on the module samples.
- Regulatory & Conformance Testing: maturity Freeze, Frozen. Regulatory configuration settings locked in the released software; changes need a regulatory review.; Regulatory settings locked
Module, package and antenna-in-package^A
- RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Module and antenna design complete, with package-aware electromagnetic models, thermal and mechanical checks and the bill of materials, ready to freeze.
- Module & Antenna-in-Package Integration: maturity Freeze, Frozen. Module and antenna design frozen; module samples are built and measured from it.^A; Module and antenna design frozen
- Regulatory & Conformance Testing: maturity Freeze, Frozen. Module and antenna design frozen; module samples are built and measured from it.
RF characterisation and measurement^D
- RF Characterisation & S-parameter Measurement: maturity 1.0, Complete. Silicon measured with fixture effects removed and correlated with simulation; module and datasheet values follow from it.^DA
- Module & Antenna-in-Package Integration: maturity 1.0, Complete. Silicon measured with fixture effects removed and correlated with simulation; module and datasheet values follow from it.
- Regulatory & Conformance Testing: maturity 1.0, Complete. Silicon measured with fixture effects removed and correlated with simulation; module and datasheet values follow from it.
Regulatory and conformance testing^A
- RF Characterisation & S-parameter Measurement: maturity 0.8, Feature complete. Pre-compliance scans running on evaluation boards and then module samples, with the pre-compliance plan final.
- Module & Antenna-in-Package Integration: maturity 0.8, Feature complete. Pre-compliance scans running on evaluation boards and then module samples, with the pre-compliance plan final.
- Regulatory & Conformance Testing: maturity 1.0, Complete. Formal testing passed and certifications granted or filed for every target market.^DA
RF production test^D
- RF Characterisation & S-parameter Measurement: maturity 0.5, Simulated. RF test strategy set at tape-out, with the test program and hardware developed on first silicon.
- Module & Antenna-in-Package Integration: maturity 0.8, Feature complete. Test program running on parts and modules and being correlated with the bench.
- Regulatory & Conformance Testing: maturity 0.8, Feature complete. Test program running on parts and modules and being correlated with the bench.
Quality and reliability^A
- RF Characterisation & S-parameter Measurement: maturity 0.5, Simulated. Early stresses run on first silicon and module samples to find weak points before qualification.
- Module & Antenna-in-Package Integration: maturity 0.5, Simulated. Early stresses run on first silicon and module samples to find weak points before qualification.
- Regulatory & Conformance Testing: maturity 0.8, Feature complete. Qualification plan final, with parts and modules built on the production flow.
Operations, supply and end of life^AA
- RF Characterisation & S-parameter Measurement: maturity 0.5, Simulated. Supply for samples and module builds running, with qualification lots planned.
- Module & Antenna-in-Package Integration: maturity 0.5, Simulated. Supply for samples and module builds running, with qualification lots planned.
- Regulatory & Conformance Testing: maturity 0.8, Feature complete. Production flow set up for the qualification lots and capacity booked for the ramp.
Program management^A
- RF Characterisation & S-parameter Measurement: maturity 0.8, Feature complete. Tape-out recorded and the plan moved on to silicon, samples, certification and qualification.
- Module & Antenna-in-Package Integration: maturity 0.8, Feature complete. Tape-out recorded and the plan moved on to silicon, samples, certification and qualification.
- Regulatory & Conformance Testing: maturity 0.8, Feature complete. Tape-out recorded and the plan moved on to silicon, samples, certification and qualification.

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