Chip lifecycle / Product types / Package or module variant

Package or module variant

Physical variant, one of the Hub's ten product types. Each type runs only the lifecycle stages and gates its kind of change needs.

What it is

Physical variantThe same die in a different package, module or assembly flow.

The same qualified die in a new package, system in package or module, or a change to the assembly materials, process or site of a released part. The die does not change.

Typical triggers

A form factor, thermal or integration need
A customer that needs a different package for the same die
An assembly supply chain change: a new assembly site, substrate or material

Examples

A second package optionA released die offered in a smaller package for space-limited designs, as a new orderable part.
A new assembly siteA released part moved to another assembly and test site, with package qualification and a change notice.
A multi-die moduleA qualified die combined with memory in a system in package for one application.

Examples are generic: they describe a kind of work, not any company's product.

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