1. Purpose and scope
A node is built from many unit processes, each performed by a module team: lithography and patterning, etch, thin film deposition, epitaxy, ion implantation, diffusion and thermal processing, chemical mechanical planarisation and wet cleans. In this stage each module is developed until it meets its own capability targets, such as critical dimension control, profile, uniformity across the wafer, film properties, defectivity and selectivity, on the tools and materials that will carry it into production.
The stage is the process counterpart of building and checking blocks before a chip is assembled. Each module is judged on its own terms, usually on blanket or short-loop wafers, because integration problems are much easier to solve when every module is known to be capable in isolation. Alongside the module work, lithography develops the patterning solution and first optical proximity correction models, integration drafts the integrated process flow, test chips plan the test vehicles, and equipment and materials supply brings new tools and materials to a state fit for development.
In scope: module process specifications, module capability reports, the patterning solution, initial OPC models, the initial integrated process flow and short-loop results, the test vehicle plan, the final equipment and materials readiness assessment and the start of tool set qualification. Out of scope: tuning the full flow and freezing the baseline, which is Process Integration & Baseline.
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