Chip lifecycle / Package technology lifecycle / Technology Roadmap & Customer Drivers

Technology Roadmap & Customer Drivers

Deciding which new package technology to develop and why: reading customer and market drivers such as bandwidth between dies, power delivery, thermal limits, form factor and cost, placing the technology on the packaging roadmap, finding lead customers and agreeing a joint development with them.

Where this stage sits

This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.

Stage

^O01 Technology Roadmap & Customer DriversYou are here

^A02 Concept & Test Vehicle Design

^A03 Materials & Substrate Development

Business and customers milestones

RATechnology roadmap approval JDAJoint development agreement signed

Technology milestones

CSTR1Package concept selected TVRTest vehicle design release MSMaterials and substrate selected

Technology business and roadmap^O

Planned

Concept

Customer engagement and joint development^A

Planned^A

Concept

Package architecture and co-design^A

Planned

Concept

Electrical, thermal and mechanical modelling^A

Planned

Concept^A

Test vehicle design and characterisation^D

Concept^D

Materials and substrate engineering^A

Planned

Concept

Wafer-level processes: bumping, RDL and fan-out^A

Planned

Concept

Interposer, TSV and hybrid bonding^D

Planned

Concept

Assembly: die attach, flip chip, underfill and moulding^A

Concept

Equipment engineering^A

Concept

Reliability and board-level qualification^A

Concept

Test and known good die^A

Concept

Package design kit and assembly design rules^A

Concept

Quality systems and change control^D

Planned

Concept

Supply chain and capacity^A

Concept

KeyPlannedTechnology plannedConceptConcept selectedBaselineBaseline frozenQualifiedQualified on test vehiclesKit releasedDesign kit releasedProductionProduction readyFaded block: Held, the status shown before it still standsFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateTRTechnical readiness review (TR): a gate that checks the technology is ready before the next commitment.You are here: Technology Roadmap & Customer DriversAI impactDisruption (red)Augmentation (blue)Opportunity (green)How AI is changing the workWhat the steps mean What the codes mean

Show this chart as a list

Stages

Technology Roadmap & Customer Drivers (this stage)^O
Concept & Test Vehicle Design^A
Materials & Substrate Development^A

Business and customers milestones

Technology milestones

Package concept selected (CS) (technical readiness review TR1)
Test vehicle design release (TVR)
Materials and substrate selected (MS)

Disciplines

Technology business and roadmap^O
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Roadmap and charter approved, then the business case and investment plan signed with the joint development agreement.
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Investment tracked while materials, modules and equipment are developed.
- Materials & Substrate Development: maturity Concept, Concept selected. Investment tracked while materials, modules and equipment are developed.
Customer engagement and joint development^A
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Customer drivers analysed and the joint development agreement signed with the lead customer requirements.^A
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Joint development reviews held with the lead customer on the concept and test vehicles.
- Materials & Substrate Development: maturity Concept, Concept selected. Joint development reviews held with the lead customer on the concept and test vehicles.
Package architecture and co-design^A
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Package technology targets set from the customer drivers.
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Package concept chosen and test vehicle requirements written.
- Materials & Substrate Development: maturity Concept, Concept selected. Package concept chosen and test vehicle requirements written.
Electrical, thermal and mechanical modelling^A
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Concept feasibility modelling started on the candidate structures.
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Feasibility results, test vehicle simulations and material models produced.^A
- Materials & Substrate Development: maturity Concept, Concept selected. Feasibility results, test vehicle simulations and material models produced.
Test vehicle design and characterisation^D
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Test vehicles designed and released, then short loops built and measured.^D
- Materials & Substrate Development: maturity Concept, Concept selected. Test vehicles designed and released, then short loops built and measured.
Materials and substrate engineering^A
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Material screening started against the technology targets.
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Materials and substrate selected with suppliers and material qualification started.
- Materials & Substrate Development: maturity Concept, Concept selected. Materials and substrate selected with suppliers and material qualification started.^A
Wafer-level processes: bumping, RDL and fan-out^A
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Module feasibility studied for bumping, redistribution layers and fan-out.
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Recipes developed and the modules proven capable.
- Materials & Substrate Development: maturity Concept, Concept selected. Recipes developed and the modules proven capable.
Interposer, TSV and hybrid bonding^D
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Stacking feasibility studied for interposer, through-silicon via and hybrid bonding options.
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Through-silicon via and bonding modules developed and proven capable.
- Materials & Substrate Development: maturity Concept, Concept selected. Through-silicon via and bonding modules developed and proven capable.
Assembly: die attach, flip chip, underfill and moulding^A
- Materials & Substrate Development: maturity Concept, Concept selected. Assembly options chosen and the modules developed to capability.
Equipment engineering^A
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Equipment requirements set and tools evaluated, selected, installed and qualified for the pilot.
- Materials & Substrate Development: maturity Concept, Concept selected. Equipment requirements set and tools evaluated, selected, installed and qualified for the pilot.
Reliability and board-level qualification^A
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Reliability test plan drafted for the test vehicles.
- Materials & Substrate Development: maturity Concept, Concept selected. Reliability test plan drafted for the test vehicles.
Test and known good die^A
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Electrical test hardware planned and test vehicle test developed.
- Materials & Substrate Development: maturity Concept, Concept selected. Electrical test hardware planned and test vehicle test developed.
Package design kit and assembly design rules^A
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Preliminary assembly design rules released with the test vehicles.
- Materials & Substrate Development: maturity Concept, Concept selected. Preliminary assembly design rules released with the test vehicles.
Quality systems and change control^D
- Technology Roadmap & Customer Drivers: maturity Planned, Technology planned. Quality plan drafted for the technology.
- Concept & Test Vehicle Design: maturity Concept, Concept selected. Quality planning carried through concept and module development.
- Materials & Substrate Development: maturity Concept, Concept selected. Quality planning carried through concept and module development.
Supply chain and capacity^A
- Materials & Substrate Development: maturity Concept, Concept selected. Supplier qualification planned and suppliers qualified for the pilot.

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