Finishing the verified die and releasing it to mask making: full-chip assembly of the array tiles, periphery and interface, physical verification against the rules and the schematics, electromigration, IR drop and electrostatic discharge checks, re-verification of late engineering changes, spare logic and metal fix provision, the core and base die databases of a stack checked against the frozen stack design, and the tape-out checklist, through to the mask order.
This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.
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