Turning wafers into packaged parts: thinning, dicing, die attach, wire bonding or flip-chip attach, moulding and marking.
This sub-function's own lane. See it beside the other sub-functions of packaging and test on the function's swimlane.
Chevrons show maturity by the end of each stage and open that stage's row below; diamonds are freeze and sign-off points; triangles are the lifecycle's gates.
The full lifecycle detail, with its charts, flows, tables and every section, is for registered members. Registration is free and takes a minute. You come back to this page afterwards.