Chip lifecycle / Chiplet lifecycle / Final & System-Level Test

Final & System-Level Test

Testing the assembled unit through its die-to-die links, switching in spare lanes to repair faults where the interface allows, followed by burn-in and system-level test.

Where this stage sits

This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.

Stage

^D07 Assembly

^A08 Final & System-Level TestYou are here

^A09 Package Qualification & Production Release

Product milestones

ESEngineering samples PRProduction release

Dies and package milestones

KGDKnown-good-die release FAFirst assembled units PQPTR3Package qualification passed

Die-to-die interface^AA

Freeze

Assembly process^DA

1.0^DA

Freeze

Assembly and test suppliers^AA

1.0^A

Final and system-level test^A

0.5

0.8^AA

1.0

Package qualification and reliability^AA

0.5

0.8^A

1.0^A

Product, cost and sourcing^AOO

0.8

1.0^A

Key0.0Started0.3Outlined0.5Feasible0.8Designed1.0CompleteFreezeFrozenFaded block: still at the step shown before it, Held below Complete or Maintained under change control once complete or frozenFreeze or sign-off pointMilestone for one item; the rest of the work carries onMilestone gateTRTechnical readiness review (TR): a gate that checks the technology is ready before the next commitment.You are here: Final & System-Level TestAI impactDisruption (red)Augmentation (blue)Opportunity (green)How AI is changing the workWhat the steps mean What the codes mean

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Stages

Assembly^D
Final & System-Level Test (this stage)^A
Package Qualification & Production Release^A

Product milestones

Dies and package milestones

Known-good-die release (KGD)
First assembled units (FA)
Package qualification passed (PQP) (technical readiness review TR3)

Disciplines

Die-to-die interface^AA
- Assembly: maturity Freeze, Frozen. PHY and controller released in the taped-out dies; an interface change now needs every die team and the package team to approve it.
- Final & System-Level Test: maturity Freeze, Frozen. PHY and controller released in the taped-out dies; an interface change now needs every die team and the package team to approve it.^A
Assembly process^DA
- Assembly: maturity 1.0, Complete. First units built and the build reviewed; the assembly process plan is final.^DA
- Final & System-Level Test: maturity Freeze, Frozen. Assembly process frozen for the qualification builds; a change now needs requalification.; Assembly process frozen for qualification
- Package Qualification & Production Release: maturity Freeze, Frozen. Assembly process frozen for the qualification builds; a change now needs requalification.^A
Assembly and test suppliers^AA
- Assembly: maturity 1.0, Complete. Lines proven on the first builds, then capacity planned with every supplier for volume.^A
- Final & System-Level Test: maturity 1.0, Complete. Lines proven on the first builds, then capacity planned with every supplier for volume.
- Package Qualification & Production Release: maturity 1.0, Complete. Lines proven on the first builds, then capacity planned with every supplier for volume.^A
Final and system-level test^A
- Assembly: maturity 0.5, Feasible. Final test program first run on the first assembled units, through the die-to-die links.
- Final & System-Level Test: maturity 0.8, Designed. Final test program final on the engineering samples, with lane repair proven; burn-in and system-level test being set up.^AA
- Package Qualification & Production Release: maturity 1.0, Complete. Final test program, burn-in and system-level test released for production at the package qualification.
Package qualification and reliability^AA
- Assembly: maturity 0.5, Feasible. Stress boards and hardware ready, with early stress runs on the first assembled units.
- Final & System-Level Test: maturity 0.8, Designed. Qualification plan final and the qualification lots in stress, built from the frozen assembly flow.^A
- Package Qualification & Production Release: maturity 1.0, Complete. Package qualification passed on units from the production flow, with every failure analysed.^A
Product, cost and sourcing^AOO
- Assembly: maturity 0.8, Designed. Supply agreed with every supplier and the cost model approved; sampling and launch planned with lead customers.
- Final & System-Level Test: maturity 0.8, Designed. Supply agreed with every supplier and the cost model approved; sampling and launch planned with lead customers.
- Package Qualification & Production Release: maturity 1.0, Complete. Production release approved, with capacity in place for volume.^A

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