Use whenever the bump map is issued or changed, to check dies, interposer or bridge and substrate agree bump by bump. Run by the package design engineer with die integration engineers and the assembly supplier.
MustThe material under review is a tagged version, named in the record.
MustReviewers received the material and this checklist early enough to prepare.
ShouldReviewers include people from the die teams, the package team and, where needed, the assembly supplier.
ShouldThe scope of the review and anything excluded are stated at the start.
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