Qualifying the packaged chip to AEC-Q100 for its temperature grade: accelerated environmental and life stress tests, electrical verification, ESD and latch-up, and package tests, on parts built on the production flow, with failures analysed to root cause. Multi-chip modules follow AEC-Q104.
This stage with its neighbours. Each row is a discipline active here, shaded by how mature its work is by the end of each stage.
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