Term · Reliability & Quality
Stress migration
Void formation in metal lines and under vias driven by tensile stress gradients from the mismatch in thermal expansion between metal and dielectric, with no current flowing.
It is screened by high temperature storage bake followed by resistance measurement.
- Also known as
- SM, stress induced voiding, SIV
- Type
- Term
- Domain
- Reliability & Quality, Failure mechanisms
Notes
Worst around 150 to 200 °C, where vacancy mobility and residual stress are both high, so the failure rate is not monotonic in temperature.
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