Process · Power & Discretes
Sintered die attach
Attaching a die using silver or copper particles that are compacted and diffused into a solid metal joint below the metal's melting point. The resulting layer has far higher thermal conductivity and melting point than solder.
- Also known as
- Silver sintering, Ag sintering
- Type
- Process
- Domain
- Power & Discretes, Power packaging
Notes
Essentially mandatory for SiC modules, where solder would fatigue long before the die reached its temperature limit.
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