Process · Physical Design & Signoff
EM-IR analysis (Electromigration and IR drop analysis)
The combined signoff step that solves the power grid for current and voltage everywhere, reporting both voltage drop at cell pins and per-segment current density against foundry electromigration limits.
- Also known as
- Rail analysis, Power integrity signoff
- Type
- Process
- Domain
- Physical Design & Signoff, Power integrity
Notes
Requires accurate switching activity, so its quality is only as good as the vectors or vectorless assumptions fed in.
Related terms
Part of the Physical Design & Signoff glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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