Glossary comparison
Final test vs Wafer sort: what is the difference?
The difference
Wafer sort tests bare dies on the wafer with a probe card before dicing. Final test tests packaged parts after assembly.
Final test happens after packaging and checks the finished part, often at temperature. Wafer sort happens before dicing and screens bare dies.
The two terms
Final test
Electrical test of the packaged device on automated test equipment, after assembly, typically across temperature and using a handler and load board rather than a wafer prober.
Wafer sort
Electrical test of individual dice while they are still on the wafer, performed with a prober and probe card, to identify which dice are worth packaging and to record a wafer map.
Side by side
| Field | Final test | Wafer sort |
|---|---|---|
| Stands for | Not an abbreviation | Not an abbreviation |
| Type | Process | Process |
| Domain | Packaging & Assembly | Test & DFT |
| Group | Assembly and test operations | Test flow and operations |