Process · Photonics, MEMS & Sensors
Bosch process
A deep silicon etch that alternates rapid isotropic etch steps with passivation polymer deposition, producing near-vertical high aspect ratio trenches at the cost of scalloped sidewalls.
- Also known as
- Time-multiplexed deep etch, Switched etch
- Type
- Process
- Domain
- Photonics, MEMS & Sensors, MEMS
Notes
Patented by Robert Bosch in the early 1990s and the foundation of most inertial and pressure MEMS structures.
Related terms
Part of the Photonics, MEMS & Sensors glossary, with every term in the topic and the lifecycles, tools and standards that use them.
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