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Normally held in October/November. No confirmed next-edition date yet.
Organizer
China Semiconductor Industry Association (CSIA) Packaging Branch
Cadence
Annual
Usual host
Rotating, China
Venue
—
Format
In-person
Scale
500-2,000
Audience
OSAT engineers, substrate and materials suppliers, test houses
Notes
Domestic OSAT community's technical and market conference, rotating among Chinese packaging hubs.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.