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Normally held in May. No confirmed next-edition date yet.
Organizer
IEEE Components, Packaging and Manufacturing Technology Society
Cadence
Annual
Usual host
Rotating, Rotating
Venue
—
Format
In-person
Scale
<500
Audience
Central and Eastern European electronics technology and packaging researchers
Notes
Rotating CEE seminar on electronics manufacturing, interconnection and packaging technologies.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.