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IEEE International Interconnect Technology Conference
(IITC)
Tier 2: established / regionalTechnical ConferenceDevices & Process Technology
Usual timing
Normally held in June. No confirmed next-edition date yet.
Organizer
IEEE Electron Devices Society
Cadence
Annual
Usual host
Rotating, Rotating
Venue
—
Format
In-person
Scale
<500
Audience
BEOL interconnect, metallization and dielectric researchers
Notes
The specialist conference on BEOL interconnect - low-k dielectrics, barrier/liner, Cu/Co/Ru metallization and RC scaling - often run jointly with the Advanced Metallization Conference (AMC).
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