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IEEE International 3D Systems Integration Conference
(3DIC)
Tier 2: established / regionalTechnical ConferenceAdvanced Packaging
Organizer
IEEE Electronics Packaging Society
Cadence
Irregular
Usual host
Rotating, Rotating
Venue
—
Format
In-person
Scale
<500
Audience
3D integration, TSV and hybrid bonding researchers
Notes
Long-standing conference dedicated to 3D IC and system integration, rotating between regions.
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