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Events / Global directory / International Microsystems, Packaging, Assembly and Circuits Technology Conference
International Microsystems, Packaging, Assembly and Circuits Technology Conference
(IMPACT)
Tier 2: established / regionalTechnical ConferenceAdvanced Packaging
Usual timing
Normally held in October. No confirmed next-edition date yet.
Organizer
Taiwan Printed Circuit Association / ITRI
Cadence
Annual
Usual host
Taipei, Taiwan
Venue
Taipei Nangang Exhibition Center
Format
In-person
Scale
500-2,000
Audience
Taiwan packaging, substrate and OSAT ecosystem
Notes
Taiwan's main packaging and substrate technical conference, co-located with TPCA Show.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.