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Events / Global directory / International Symposium on the Physical and Failure Analysis of Integrated Circuits
International Symposium on the Physical and Failure Analysis of Integrated Circuits
(IPFA)
Tier 2: established / regionalTechnical ConferenceTest & Reliability
Usual timing
Normally held in July. No confirmed next-edition date yet.
Organizer
IEEE Electron Devices Society / IEEE Reliability Society
Cadence
Annual
Usual host
Rotating, Rotating
Venue
—
Format
In-person
Scale
<500
Audience
Failure analysis engineers, reliability and quality teams in Asia
Notes
Asia's leading physical failure analysis and reliability symposium, rotating among Singapore, Malaysia, China and other regional hosts.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.