Delayed, as of 16:35 UTC. Source: delayed quotes from a public quote service, refreshed at most every two minutes. Prices in each listing's own currency. Market data, not investment advice.
Tier 2: established / regionalTechnical ConferenceAdvanced Packaging
Usual timing
Normally held in April/May. No confirmed next-edition date yet.
Organizer
Japan Institute of Electronics Packaging (JIEP)
Cadence
Annual
Usual host
Rotating, Japan
Venue
—
Format
In-person
Scale
500-2,000
Audience
Japanese and international packaging researchers
Notes
JIEP's flagship international packaging conference, often co-organized with IMAPS or IEEE EPS.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.