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European Microelectronics and Packaging Conference
(EMPC)
Tier 2: established / regionalTechnical ConferenceAdvanced Packaging
Usual timing
Normally held in September. No confirmed next-edition date yet.
Organizer
IMAPS Europe
Cadence
Biennial
Usual host
Rotating, Rotating
Venue
—
Format
In-person
Scale
500-2,000
Audience
European packaging, assembly and materials community
Notes
IMAPS Europe's biennial flagship, alternating years with ESTC.
From The Semiconductor Hub's Global Semiconductor Events Directory: a research seed, not yet editorially verified row by row. Spotted an error?Let us know.