This thread is for discussing the lifecycle document "Test Chip Design & Shuttle Tape-out: stage guide".
How a startup designs, verifies and implements a test chip that proves the riskiest parts of its architecture, and tapes it out on a multi-project wafer shuttle or a small dedicated run. It covers scoping discipline, verification and sign-off on a reduced scope, design for test and debug, working with a design services partner, shuttle cut-off discipline, packaging and board preparation and the tape-out archive. It is written for RTL, verification and physical design engineers and the tape-out program manager.
Read the document: https://www.thesemiconhub.com/lifecycle/startup/su-test-chip/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.