This thread is for discussing the lifecycle document "Engineering samples: gate review pack".
The product track review that releases assembled multi-die units which pass final test, including die-to-die link tests, to lead customers and internal validation. This pack covers participants, evidence, agenda, outcomes, reviewers' questions, the decision record and the actions that follow. It is for product line managers, final test and interface engineers, quality and customer-facing teams.
Read the document: https://www.thesemiconhub.com/lifecycle/chiplet/gates/chiplet-engineering-samples/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.