This thread is for discussing the lifecycle document "Die and package supply agreed: gate review pack".
The product track review that confirms suppliers for every die, the interposer, the substrate, assembly and test are agreed, with their quality expectations and an updated cost model. This pack covers participants, evidence, agenda, outcomes, reviewers' questions and the decision record. It is for sourcing managers, supplier managers, product line managers, quality and finance.
Read the document: https://www.thesemiconhub.com/lifecycle/chiplet/gates/chiplet-supply-agreed/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.