1. Purpose of the gate
A multi-die product depends on more suppliers than a single-chip one: foundries for each die, any third-party chiplet supplier, the interposer or bridge maker, the substrate maker, the assembly supplier and the test supplier. Each is a single point of failure for the product. This gate confirms that every one of them is under agreement before the design is released to manufacture.
The criteria are: supply agreements in place for every component; known-good-die quality expectations agreed with each die supplier; and a cost model updated and approved. The quality expectation matters most. Because one faulty die scraps a whole assembled unit, the quality each die supplier delivers sets the assembly yield, and the agreement must say what is tested, to what level, with what data, and what happens when a die escapes.
The gate closes the product side of the Interposer & Substrate Design stage and feeds the product's design release.
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