Technologies
Cross-cutting technologies (chiplets, RISC-V, silicon photonics and more) that sit alongside value-chain segment and target market as their own way to browse the industry. A company can belong to one segment and several topics at once.
Disaggregated die, heterogeneous integration and the packaging technologies (2.5D/3D, hybrid bonding, interposers) that connect them.
Processor cores and platforms built on RISC-V or other open, royalty-free instruction set architectures.
Stacking active silicon layers vertically — through-silicon vias, wafer-on-wafer and die-on-wafer bonding.
Optical components and interconnects built on silicon or silicon-compatible processes, for communications, sensing and compute.
Power semiconductors built on gallium nitride, silicon carbide and other wide-bandgap materials for higher efficiency and switching frequency.
High-bandwidth memory and the stacking, test and interconnect technologies that support it.
SerDes, PCIe, CXL, UCIe and other high-speed chip-to-chip and chip-to-system interconnect standards.
ISO 26262 and related functional-safety disciplines applied to automotive semiconductor design.
Hardware roots of trust, secure boot, cryptographic accelerators and tamper resistance.
Purpose-built silicon for AI training and inference workloads, distinct from general-purpose compute.
Spiking, event-driven neuromorphic hardware and accelerators, distinct from general-purpose AI/ML accelerator silicon.