Hub Product Codes
The platform's value-chain segments and product/service categories, published as an open, versioned standard: stable identifiers a company profile, listing or third-party integration can reference consistently. Schema version 1 · .
Value-chain segments (18)
FABLESS_DESIGNDesigns chips without owning fabrication — outsources manufacturing to a foundry.
IDMIntegrated Device Manufacturer — designs and fabricates its own chips in owned fabs.
FOUNDRYFabricates chips designed by other companies under contract.
OSAT_PACKAGINGOutsourced Semiconductor Assembly and Test — packages and tests die into finished parts.
IP_VENDORLicenses reusable circuit designs (IP cores) for integration into other companies' chips.
EDAElectronic Design Automation — software tools used to design, verify and lay out chips.
EQUIPMENTManufactures the capital equipment fabs and OSATs use to process wafers and package die.
MATERIALSSupplies the raw and specialty materials semiconductor manufacturing consumes.
DISTRIBUTIONDistributes components and materials between manufacturers and buyers.
RESEARCH_INSTITUTEAcademic or public research organization active in semiconductor R&D.
EMSElectronics Manufacturing Services — assembles boards, modules and finished systems under contract; board-level, not chip-level packaging.
MODULES_STORAGEAssembles memory modules, SSDs and embedded storage products from third-party memory and controller chips.
PASSIVES_INTERCONNECTDiscrete passive components (capacitors, resistors, inductors, crystals, filters), connectors, cables and thermal parts — board-level components, not fab consumables.
PCB_ASSEMBLYFabricates printed circuit boards and flexible circuits and assembles components onto them — board-level, distinct from IC package substrates and from full-system EMS.
POWER_SUPPLIESBoard- and system-level power supplies, converters, chargers and battery modules built from semiconductor components.
DESIGN_SERVICESIC, ASIC, FPGA and SoC design houses and engineering-services firms working on a client's chip — services, not licensed IP or own products.
TEST_ANALYSIS_SERVICESIndependent test, qualification, reliability, failure-analysis and materials-analysis laboratories — services, not production packaging or equipment.
LEGAL_SERVICESProvides legal services to semiconductor-industry companies and professionals.
Product & service categories (18)
IP_ANALOG_MIXED_SIGNALLicensable analog and mixed-signal IP (PLLs, ADCs/DACs, power management).
IP_CPU_PERIPHERALSLicensable CPU cores and peripheral IP blocks.
IP_INTERFACELicensable interconnect/interface IP (e.g. PCIe, USB, SerDes).
IP_MEMORY_PHYLicensable IP for memory controllers and physical-layer (PHY) interfaces.
IP_SECURITYLicensable security and root-of-trust IP.
IP_WIRELESSLicensable wireless connectivity IP.
PRODUCT_BOARD_MODULEA finished board- or module-level hardware product.
PRODUCT_CHIPA finished, catalog semiconductor chip product.
PRODUCT_EQUIPMENTA capital-equipment product for fabrication, test or packaging.
PRODUCT_MATERIALA raw or specialty material product.
PRODUCT_SOFTWARE_TOOLA software product for the semiconductor industry.
SERVICE_CONSULTINGSemiconductor-industry consulting services.
SERVICE_DESIGNContract digital/analog design services.
SERVICE_DFT_TESTContract design-for-test and production-test services.
SERVICE_MANUFACTURINGContract wafer-fabrication or manufacturing services.
SERVICE_PACKAGINGContract packaging and assembly services.
SERVICE_PHYSICAL_DESIGNContract physical-design (place & route, signoff) services.
SERVICE_VERIFICATIONContract functional-verification services.
IP catalogue classes (12)
The function classes the IP catalogue uses, version 1. Each one extends an IP category above and declares the key characteristics compared within that class. Every value carries its own source type.
IP_CLASS.PROCESSORExtends IP — CPU & peripherals. Key characteristics: Instruction set, Pipeline, Maximum frequency, Cache configuration, Functional safety support.
IP_CLASS.DSPExtends IP — CPU & peripherals. Key characteristics: Architecture, Data types, Maximum frequency, Toolchain.
IP_CLASS.MEMORY_CONTROLLERExtends IP — Memory / PHY. Key characteristics: Memory standard, Maximum data rate, Channels, Error correction support.
IP_CLASS.PHYExtends IP — Memory / PHY. Key characteristics: Protocol, Maximum data rate per lane, Lane configurations, Reach or channel loss, Power per bit or per lane.
IP_CLASS.INTERFACE_CONTROLLERExtends IP — Interface. Key characteristics: Protocol and version, On-chip bus interface, Optional features supported.
IP_CLASS.ANALOG_MIXED_SIGNALExtends IP — Analog / mixed-signal. Key characteristics: Function, Resolution or accuracy, Sample rate or bandwidth, Power, Area.
IP_CLASS.RFExtends IP — Wireless. Key characteristics: Frequency band, Radio standard, Noise figure, Output power.
IP_CLASS.SECURITYExtends IP — Security. Key characteristics: Function, Algorithms, Certification, Side-channel countermeasures.
IP_CLASS.VERIFICATION_IPNo existing IP category covers this class yet. Key characteristics: Protocol and version, Methodology, Supported simulators, Coverage model included.
IP_CLASS.NOC_INTERCONNECTExtends IP — Interface. Key characteristics: Topology, Protocols bridged, Coherency support, Quality-of-service features.
IP_CLASS.CHIPLET_INTERFACEExtends IP — Interface. Key characteristics: Die-to-die standard, Packaging, Bandwidth density, Energy per bit.
IP_CLASS.AI_ML_ACCELERATORNo existing IP category covers this class yet. Key characteristics: Data types, Peak throughput, Memory interface, Supported frameworks.