Joining a chip to its package with very thin metal wire, using heat, pressure and ultrasonic energy, and tuning the process for strong, reliable bonds.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: Packaging training, hands-on work with bonders, and pull and shear testing.
Register version 1.