Using TEM for atomic-to-nanometre scale semiconductor analysis: FIB lamella preparation, bright/dark field and STEM-HAADF imaging, EELS and EDX for composition, and measuring gate stack, high-k, interface and defect structure at sub-nm resolution.
No statement on what tools can do has been recorded for this skill yet.
The Hub knows of no registered course, programme or certification for this skill yet.
Note from the research register: Materials characterization role, usually with graduate microscopy training; extended apprenticeship on FIB prep and TEM operation.
Register version 1.