Wafer Bonding and 3D Integration Process Engineer

Project

Work done for a product or program.

• Develop Cu-to-Cu hybrid bonding with CMP, surface activation and annealing steps.
• Control dielectric roughness, dishing and particle defects to meet bond yield.
• Characterise bond strength, void formation and alignment with metrology and acoustic imaging.
• Qualify tools and consumables with equipment suppliers.
• Run experiments to scale pitch and reduce bond temperature.
• Support CMOS-array-bonded NAND and memory-on-logic integration programmes.
• Document recipes and transfer them to production lines.

Function

Work that keeps the discipline running: methods, tools, suppliers and people.

• Maintain the policies, processes and tools of the function.General
• Keep the function compliant with legal, financial and regulatory requirements.General
• Report the function's performance and improve it over time.General

Project

1. Produce and hand over the role's key deliverables
   • Hybrid bonding process recipes
   • Bond quality and void metrology reports
   • Equipment qualification reports
   • Process transfer documents
2. Support programsGeneral
   • Agree what each program needs
   • Deliver in time for milestones
3. Manage issuesGeneral
   • Track requests to closure
   • Escalate risks

Function

1. Run the functionGeneral
   • Maintain policies and processes
   • Keep records and controls
2. ImproveGeneral
   • Report performance
   • Lead improvement work