Memory Packaging Engineer

Project

Work done for a product or program.

• Develop DRAM die stacking with TSV, micro-bump and mass reflow or thermocompression bonding.
• Define package structures for DDR, LPDDR, HBM and 3D NAND multi-die stacks.
• Run thermal, warpage and stress simulations for stacked memory.
• Qualify materials such as underfill, NCF and mold compound.
• Drive yield improvement for known-good-die stacking.
• Define reliability test plans per JEDEC and customer needs.

Function

Work that keeps the discipline running: methods, tools, suppliers and people.

• Work with equipment suppliers on bonding, grinding and stacking processes.

Project

1. Produce and hand over the role's key deliverables
   • Package design and process specifications
   • Thermal and warpage simulation reports
   • Stack yield analyses
   • Reliability qualification data
2. Support programsGeneral
   • Agree what each program needs
   • Deliver in time for milestones
3. Manage issuesGeneral
   • Track requests to closure
   • Escalate risks

Function

1. Run the functionGeneral
   • Maintain policies and processes
   • Keep records and controls
2. ImproveGeneral
   • Report performance
   • Lead improvement work