Roles / Assembly Equipment Engineer

Assembly Equipment Engineer

PKG-064v1

Advanced Packaging & AssemblyIC2-IC5Individual contributor

Also known as: Die Bonder Equipment Engineer; Back-End Equipment Engineer; Packaging Equipment Engineer; Assembly Tool Engineer

See this role on the SoC lifecycle

Summary

Keeps assembly tools, such as bonders, saws, molders and TCB systems, running at specification and uptime targets.

A day in the life

Work in progressNo day-in-the-life description has been written for this role yet. If you do this work, we would welcome yours. Suggest a source or a correction

Responsibilities

Project

Work done for a product or program.

Troubleshoot bonders, die attach, saw and mold equipment
Define preventive maintenance and calibration plans
Qualify new tools and tool upgrades
Analyse downtime, MTBF and MTTR
Implement recipe and software controls

Function

Work that keeps the discipline running: methods, tools, suppliers and people.

Coordinate vendor service and spares
Lead equipment automation and uptime improvements

Major tasks

Project

Produce and hand over the role's key deliverables
- Equipment qualification reports
- PM and calibration plans
- Downtime and OEE reports
- Spare parts plan
Support programsGeneral
- Agree what each program needs
- Deliver in time for milestones
Manage issuesGeneral
- Track requests to closure
- Escalate risks

Function

Run the functionGeneral
- Maintain policies and processes
- Keep records and controls
ImproveGeneral
- Report performance
- Lead improvement work

Works with

Process engineers
Equipment vendors
Maintenance technicians
Production
Quality engineers

Typical backgrounds

BS in mechanical, mechatronics or electrical engineering; 2-8 years

Demand signal

0 open listings right now
0 Talent Wafer employer inquiries

Counts live listings tagged to this role, and employer interest in candidates from Talent Wafer runs for this role (all runs to date). Hub activity only, not the wider market.

Comp tier (within semis)

3 / 5

Remote feasibility

Low

Semis core vs. portable

Semis-primary, transfers

Geographic hotspots

Penang; Kuala Lumpur; Kaohsiung; Suzhou; Manila

Transfers to (industries)

Factory automation; Electronics manufacturing services; Medical device manufacturing; Aerospace manufacturing

Risk if vacant

Equipment downtime reduces OSAT output and puts delivery commitments at risk.

Assembly Equipment Engineer

Summary

A day in the life

Responsibilities

Project

Function

Major tasks

Project

Function

Works with

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