ASIC Package Design Engineer, Design Services

Project

Work done for a product or program.

• Select package type, ball map and substrate stack-up with the customer and OSAT.
• Co-design bump map and pad ring with the physical design team.
• Route substrates for high-speed interfaces and power delivery.
• Run signal integrity, power integrity and thermal simulation of the package.
• Support 2.5D and chiplet integration where the project requires it.
• Review assembly yield and warpage feedback from first builds.

Function

Work that keeps the discipline running: methods, tools, suppliers and people.

• Check design rules with the substrate and assembly vendors.

Project

1. Produce and hand over the role's key deliverables
   • Package specification and ball map
   • Substrate layout database
   • SI, PI and thermal analysis reports
   • Assembly design-rule check sign-off
2. Support programsGeneral
   • Agree what each program needs
   • Deliver in time for milestones
3. Manage issuesGeneral
   • Track requests to closure
   • Escalate risks

Function

1. Run the functionGeneral
   • Maintain policies and processes
   • Keep records and controls
2. ImproveGeneral
   • Report performance
   • Lead improvement work