From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing

High-power impulse magnetron sputtering (HiPIMS) produces denser, better-adhering films than conventional sputtering, but scaling it to 200mm-plus substrates and inline production takes more than turning up the power. Authors from VON ARDENNE describe the engineering investment needed to move the technique from the lab into high-volume manufacturing. The post From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing appeared first on Semiconductor Digest.

Source: Semiconductor Digest, published 2026-10-28. The summary is the Hub's own; the full story is at the source. Report a rights or accuracy concern